Laser Cutting

LLTI has evolved to become a partner in our customer’s supply chain where we offer services that can supply customers with finished products and/or components for product assembly; cut from a wide variety of materials and substrates that require tight tolerancing.

Applications:
We have in depth experience dicing and re-shaping semiconductor wafers, cutting metal and polymer stents (bio-absorbable), washers, gears, gaskets, stencils, shadow masks out of flat sheets and tubing. We also specialize in cutting flat or 2-D ceramic and nitinol parts for use as components or IC substrates.

Materials:
We can produce custom shape parts (hole, slots and curved patterns) made from tubes or shim stock materials. Metals include steel(tool steel, SS, Haste alloy), aluminum, nitinol, magnesium, copper, brass, gold, platinum, tungsten, titanium, tantalum and molybdenum. Other machinable materials include polymers, acrylic, polyimides, ceramic, sapphire, diamond, graphite, semiconductor wafers & circuits and plastics.

Specifications and Tolerances:
Our focusing systems can produce kerfs widths below the 10 um level, leaving clean edges and extremely fine cuts. Our motion systems feature a working area up to 18”X24” with absolute positional accuracy to better than +/- .001" within working area.