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Applications:
Cutting and re-shaping semiconductor wafers. Cutting washers, gears, gaskets, stencils and other parts out of flat sheets and tubing. Cutting of flat or three-dimensional ceramic parts for use as components or IC substrates.
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Materials:
We can produce any shape parts made from tubes or shim stock materials. Metals include stainless steel, brass, gold, and exotic alloys. Parts could be cut out of most ceramic, semiconductor and plastic materials. Diamond, sapphire, and graphite composites are among the materials suitable for laser cutting. The unique high-resolution lasers produce kerfs widths below the 10 um level, leaving non-damaged edges and extremely fine cuts. Holes, slots, and curved patterns are achievable.
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